From: Kai Keskinen ([email protected])
Date: Fri Mar 03 2000 - 08:00:52 PST
Andrew:
I suggest you talk to the board fab houses. SANMINA and Viasystems (UK)
might be good places to start. Both outfits will be happy to give you a lot
of the info you are asking.
Cheers,
Kai Keskinen
Equipment and Network Interconnect
Nortel Subsystems and Performance Networks (NSPaN)
(613)-765-3506 (ESN 395)
[email protected] <mailto:[email protected]>
-----Original Message-----
From: Andrew Phillips [SMTP:[email protected]]
Sent: Friday, March 03, 2000 8:30 AM
To: SI-LIST
Subject: [SI-LIST] : PCB fabrication technology - what's new?
Hi all,
Trying to collect some info about the current state of PCB
fabrication
technology - can anyone point to some articles or other info
describing
the following kind of stuff:
- what actual steps are involved in producing a multi-layer PCB
these
days?
- what is the current state of PCB fabrication technology (leading
edge
and practical)
- what component tolerances, trace tolerances, via sizes etc are
usually possible these days? practical?
- approximate cost penalties for adding extra layers?
- buried or blind vias? are they worth using or often too expensive?
is
it usually better to just add extra layers to help with routing?
- special dielectric materials to improve capacitance between
power/gnd
planes? is this worthwhile or too expensive/tricky to give much
advantage?
- any other significant new stuff to be aware of?
Thanks for any help - just trying to update myself on what's out
there.
Andrew Phillips
Supercomputing Systems AG
Zurich, Switzerland
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