RE: [SI-LIST] : PCB fabrication technology - what's new?

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From: Kai Keskinen (keskinen@nortelnetworks.com)
Date: Fri Mar 03 2000 - 08:00:52 PST


Andrew:

I suggest you talk to the board fab houses. SANMINA and Viasystems (UK)
might be good places to start. Both outfits will be happy to give you a lot
of the info you are asking.

Cheers,

Kai Keskinen
Equipment and Network Interconnect
Nortel Subsystems and Performance Networks (NSPaN)
(613)-765-3506 (ESN 395)
keskinen@nortelnetworks.com <mailto:keskinen@nortelnetworks.com>

        -----Original Message-----
        From: Andrew Phillips [SMTP:andrew@scs.ch]
        Sent: Friday, March 03, 2000 8:30 AM
        To: SI-LIST
        Subject: [SI-LIST] : PCB fabrication technology - what's new?

        Hi all,

        Trying to collect some info about the current state of PCB
fabrication
        technology - can anyone point to some articles or other info
describing
        the following kind of stuff:

        - what actual steps are involved in producing a multi-layer PCB
these
        days?

        - what is the current state of PCB fabrication technology (leading
edge
        and practical)
            - what component tolerances, trace tolerances, via sizes etc are
        usually possible these days? practical?

        - approximate cost penalties for adding extra layers?

        - buried or blind vias? are they worth using or often too expensive?
is
        it usually better to just add extra layers to help with routing?

        - special dielectric materials to improve capacitance between
power/gnd
        planes? is this worthwhile or too expensive/tricky to give much
        advantage?

        - any other significant new stuff to be aware of?

        Thanks for any help - just trying to update myself on what's out
there.

        Andrew Phillips
        Supercomputing Systems AG
        Zurich, Switzerland

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