RE: [SI-LIST] : PCB fabrication technology - what's new?

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From: Gaines, William (WILLIAM.GAINES@Aerojet.com)
Date: Tue Mar 07 2000 - 10:33:56 PST


For those interested in touring a PCB fabrication house, (in the LA
Calif area), Please post to me (not the list).

The Orange Chapter of the International Microelectronic And Packaging
Society (IMAPS-OC) and the IPC Designers council is having a tour of
McCurdy Circuits (Anaheim, Ca) on 27 April 2000.
Dave Hoover of McCurdy Circuits, will make a presentation on
Controlled Impedance Boards and PCB Surface Finishes.

Bill Gaines
IMAPS-OC Newsletter Editor
626-812-2199 m-f 7-3:30
william.gaines@aerojet.com

> ----------
> From: Shawn X. Arnold[SMTP:sarnold@cpcibackplanes.com]
> Reply To: si-list@silab.eng.sun.com
> Sent: Friday, March 03, 2000 8:47 AM
> To: si-list@silab.eng.sun.com
> Subject: Re: [SI-LIST] : PCB fabrication technology - what's new?
>
> Andrew,
>
> The best thing that you can do is to take a tour of a quality fabrication
> house. Most salespeople can arrainge this for you at their facility. The
> knowledge that you gain from this will stick for years.
>
> Shawn Arnold
> International Product Design Inc.
>
> -----Original Message-----
> From: Andrew Phillips <andrew@scs.ch>
> To: SI-LIST <si-list@silab.eng.sun.com>
> Date: Friday, March 03, 2000 7:50 AM
> Subject: [SI-LIST] : PCB fabrication technology - what's new?
>
>
> >
> >
> >Hi all,
> >
> >Trying to collect some info about the current state of PCB fabrication
> >technology - can anyone point to some articles or other info describing
> >the following kind of stuff:
> >
> >- what actual steps are involved in producing a multi-layer PCB these
> >days?
> >
> >- what is the current state of PCB fabrication technology (leading edge
> >and practical)
> > - what component tolerances, trace tolerances, via sizes etc are
> >usually possible these days? practical?
> >
> >- approximate cost penalties for adding extra layers?
> >
> >- buried or blind vias? are they worth using or often too expensive? is
> >it usually better to just add extra layers to help with routing?
> >
> >- special dielectric materials to improve capacitance between power/gnd
> >planes? is this worthwhile or too expensive/tricky to give much
> >advantage?
> >
> >- any other significant new stuff to be aware of?
> >
> >
> >Thanks for any help - just trying to update myself on what's out there.
> >
> >Andrew Phillips
> >Supercomputing Systems AG
> >Zurich, Switzerland
> >
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