[SI-LIST] : PCB fabrication technology - what's new?

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From: Andrew Phillips (andrew@scs.ch)
Date: Fri Mar 03 2000 - 05:30:09 PST


Hi all,

Trying to collect some info about the current state of PCB fabrication
technology - can anyone point to some articles or other info describing
the following kind of stuff:

- what actual steps are involved in producing a multi-layer PCB these
days?

- what is the current state of PCB fabrication technology (leading edge
and practical)
    - what component tolerances, trace tolerances, via sizes etc are
usually possible these days? practical?

- approximate cost penalties for adding extra layers?

- buried or blind vias? are they worth using or often too expensive? is
it usually better to just add extra layers to help with routing?

- special dielectric materials to improve capacitance between power/gnd
planes? is this worthwhile or too expensive/tricky to give much
advantage?

- any other significant new stuff to be aware of?

Thanks for any help - just trying to update myself on what's out there.

Andrew Phillips
Supercomputing Systems AG
Zurich, Switzerland

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