From: Shawn X. Arnold (firstname.lastname@example.org)
Date: Fri Mar 03 2000 - 08:47:44 PST
The best thing that you can do is to take a tour of a quality fabrication
house. Most salespeople can arrainge this for you at their facility. The
knowledge that you gain from this will stick for years.
International Product Design Inc.
From: Andrew Phillips <email@example.com>
To: SI-LIST <firstname.lastname@example.org>
Date: Friday, March 03, 2000 7:50 AM
Subject: [SI-LIST] : PCB fabrication technology - what's new?
>Trying to collect some info about the current state of PCB fabrication
>technology - can anyone point to some articles or other info describing
>the following kind of stuff:
>- what actual steps are involved in producing a multi-layer PCB these
>- what is the current state of PCB fabrication technology (leading edge
> - what component tolerances, trace tolerances, via sizes etc are
>usually possible these days? practical?
>- approximate cost penalties for adding extra layers?
>- buried or blind vias? are they worth using or often too expensive? is
>it usually better to just add extra layers to help with routing?
>- special dielectric materials to improve capacitance between power/gnd
>planes? is this worthwhile or too expensive/tricky to give much
>- any other significant new stuff to be aware of?
>Thanks for any help - just trying to update myself on what's out there.
>Supercomputing Systems AG
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