From: Dima Smolyansky (firstname.lastname@example.org)
Date: Tue Feb 13 2001 - 16:16:43 PST
We have a couple of application notes that will specifically answer your
questions regarding package characterization. The application notes can be
downloaded from our web site at http://www.tdasystems.com/support.htm. Click
on "View application materials by interconnect type", and then click on
"Packages." The appnote of the most interest to you would be:
TDR Techniques for Characterization and Modeling of Electronic Packaging (
PDF, 800KB), which is to be published in HDI Magazine in March and April
And by the way, we thank everybody for the feedback that we have received
regarding this application note.
TDA Systems, Inc.
11140 SW Barbur Blvd., Suite 100
Portland, OR 97219
(503) 246-2282 (fax)
(503) 804-7171 (mobile)
The Interconnect Modeling Company(TM)
----- Original Message -----
From: "Ozgur Misman" <email@example.com>
Sent: Tuesday, February 13, 2001 3:02 PM
Subject: [SI-LIST] : Feedback needed in TDR measurements
> Hello everyone,
> We have capital to put together a TDR analysis capability for high speed
> interconnect characterization. our focus is mainly BGA, leadframe and high
> 1500+ I/O flip chip packages with interconnect length ranging from 2 mm to
> mm. As in any package construction vias, traces, solderballs, chip bumps
> make up a signal net.
> We are in the process of determining what equipment we would need to
> characterize interconnects ( at package level) with risetimes as low as
> picosecond. We would also include differential pair characterization as
> since wee see the use of differential pairs at package level more and
> If you would send some feedback on your experience with TDR equipment, or
> setup that works in high speed domain and provides good repeatibility, I
> ver much appreciate your feedback.!.
> Thanks in advance
> Ozgur Misman
> Sr. Engineer/scientist
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