From: Offer Kaye (firstname.lastname@example.org)
Date: Tue Feb 13 2001 - 23:15:18 PST
Ozgur, I would also check out how VNA systems compare to TDR ones in these
type of measurements.
As another avenue of research I would suggest a good book, such
as: "High-frequency characterization of electronic packaging", from
Kluwer Academic Pub; ISBN: 0792383079.
On Tue, 13 Feb 2001, Ozgur Misman wrote:
> Hello everyone,
> We have capital to put together a TDR analysis capability for high speed
> interconnect characterization. our focus is mainly BGA, leadframe and high end
> 1500+ I/O flip chip packages with interconnect length ranging from 2 mm to 20
> mm. As in any package construction vias, traces, solderballs, chip bumps etc
> make up a signal net.
> We are in the process of determining what equipment we would need to properly
> characterize interconnects ( at package level) with risetimes as low as 50~100
> picosecond. We would also include differential pair characterization as well
> since wee see the use of differential pairs at package level more and more.
> If you would send some feedback on your experience with TDR equipment, or a
> setup that works in high speed domain and provides good repeatibility, I would
> ver much appreciate your feedback.!.
> Thanks in advance
> Ozgur Misman
> Sr. Engineer/scientist
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