You may be interested to know that the National Center for
Manufacturing Sciences in conjunction with industry is
actively pursuing high eR boards. I am part
of this exercise.
I was particularly interested in the concerns about
flight time and wondered if the group could recommend
some tests (other than the obvious!) that could help set
some boundaries on this technology.
2270 Sth 88th Street
Louisville CO 80027 MS 4262
Symposium Website URL: http://www.ball.com/aerospace/ieee_emc.html
>From: Elya B. Joffe[SMTP:firstname.lastname@example.org]
>Sent: Monday, June 15, 1998 3:58 PM
>Subject: Re: [SI-LIST] : High Permittivity Board Level Decoupling and
>a) High Permittivity Dielectrics
>We are considering to use, for RF and ultra-high speed digital circuits,
>high permittivity dielectrics between the PCBs ("Thick Film FODEL").
>Assume a separation between GND and VCC of 1.6mil, and a dielectric
>constant Epsilon(r) of 5,000.
>We have calculated that for a sq. Inch of PCB this is "worth" about 700nF of
>In this case, would discrete decoupling capacitors actually be necessary,
>would they be of any avail or perhaps even the opposite? Any input on this
>be greatly appreciated.
>b) Analog Circuit Decoupling
>Does anyone know any "rule of thumb" for selecting the proper value of
>decoupling capacitors for <underline>analog circuits</underline>? In digital
>circuits - the rise time and
>switching currents of the devices play an important role... What are the
>considerations in Analog circuits???
>Any reply to either or both questions will be greatly appreciated.
> Elya B. Joffe - EMC Engineer
>Every success begins with the launching of a dream
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