RE: [SI-LIST] : skin effect and transmission line simulators

Clardy, John D (John.Clardy@PSS.Boeing.com)
Thu, 18 Sep 1997 09:30:53 -0700

Mr. Mellitz posed the question below and I have not seen an answer or
discussion. Has their been?

> ----------
> From: Mellitz, Richard[SMTP:mellitz@xgate.columbiasc.ncr.com]
> Sent: Tuesday, September 09, 1997 4:40 AM
> To: 'si-list@silab.Eng.Sun.COM'
> Subject: RE: [SI-LIST] : skin effect and transmission line
> simulators
>
> Interesting. BGA foot print effects... eh. So how big a problem is
> it? Are we talking greater than or less than 100 ps of extra
> transition
> time delay? Are coupling coefficients increased by greater that 10%?
> I
> know.. I know.. What frequency, what drive, etc. etc.. Do you have a
> handle on how big a problem it is and when it is prudent to include
> such?
>
> Rich Mellitz, NCR
> >----------
> >From: Dr. Edward P. Sayre[SMTP:esayre@nesa.com]
> >Sent: Monday, September 08, 1997 7:27 PM
> >To: fangj@binghamton.edu
> >Cc: si-list@silab.Eng.Sun.COM
> >Subject: Re: [SI-LIST] : skin effect and transmission line
> simulators
> >
> >Funny you should mention this. This is exactly the problem in
> estimating
> >the footprint effects we have seen in BGA dispersion problems.
> Having the
> >package paramters is only half the problem. Who will provide the
> rest of
> >the circuit information for packaging?
> >
> >ed sayre
> >
> >At 11:20 AM 9/5/97 -0400, you wrote:
> >>
> >>
> >>On Thu, 4 Sep 1997, Al Barber wrote:
> >>
> >>> Chris Simon wrote:
> >>> >
> >>>
> >>> > The simulator I'm looking for should include all of the
> following:
> >>> ....
> >>> >
> >>> > I would be interested in hearing which of the above criteria are
> met by
> >>> > other tools, or whether a future revision will incorporate these
> >>>>features.
> >>>
> >>> There is an additional feature I'm surprised you don't mention.
> How
> >>> about crosstalk among multiple lines?
> >>>
> >>> Al Barber
> >>> Hewlett Packard Labs
> >>>
> >>
> >>Crosstalk not only appears between multiple parallel lines, but also
> >>between vias. Our recent study shows that electromagnetic coupling
> between
> >>vias is often as significant as or sometimes even more significant
> than
> >>the coupling between parallel traces. A signal integrity software
> tool is
> >>better to be able to accurately model the coupling between multiple
> lines,
> >>vias, as well as the voltage fluctuations in the power and ground
> supply
> >>systems.
> >>
> >>
> >>Jiayuan Fang
> >>SUNY-Binghamton
> >>
> >>
> >>
> >
> >
> >
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> >| ------------------------------------- |
> >| "High Performance Engineering & Design" |
> >+~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~+
> >| Dr. Ed Sayre e-mail: esayre@nesa.com |
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> >| Stow, MA 01775 USA Fax +1.508.897-5359 |
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> >
> >
> >
>