RE: [SI-LIST] : Feedback needed in TDR measurements

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From: Knighten, Jim L (JK100005@exchange.SanDiegoCA.NCR.COM)
Date: Wed Feb 14 2001 - 09:52:49 PST


Offer,

That is a very good suggestion. Check out http://www.atn-microwave.com/
<http://www.atn-microwave.com/> for the ATN Multiport Vector network
analyzer solution - especially the time domain software which can emulate
TDR techniques from frequency domain data (which have a better
signal-to-noise characteristic).

Jim
________________________________________________________
Dr. Jim Knighten e-mail: jim.knighten@ncr.com
<jim.knighten@ncr.com>
Technical Consultant - Design
NCR
17095 Via del Campo
San Diego, CA 92127 http://www.ncr.com <http://www.ncr.com>
Tel: 858-485-2537
Fax: 858-485-3788

                -----Original Message-----
                From: Offer Kaye [mailto:sofferk@techst02.technion.ac.il]
                Sent: Tuesday, February 13, 2001 11:15 PM
                To: Ozgur Misman
                Cc: si-list@silab.eng.sun.com
                Subject: Re: [SI-LIST] : Feedback needed in TDR
measurements

                Ozgur, I would also check out how VNA systems compare to TDR
ones in these
                type of measurements.

                As another avenue of research I would suggest a good book,
such
                as: "High-frequency characterization of electronic
packaging", from
                Kluwer Academic Pub; ISBN: 0792383079.

                Offer Kaye
                oferk@oren.co.il
                sofferk@techst02.technion.ac.il

                On Tue, 13 Feb 2001, Ozgur Misman wrote:

>
>
> Hello everyone,
>
> We have capital to put together a TDR analysis capability
for high speed
> interconnect characterization. our focus is mainly BGA,
leadframe and high end
> 1500+ I/O flip chip packages with interconnect length
ranging from 2 mm to 20
> mm. As in any package construction vias, traces,
solderballs, chip bumps etc
> make up a signal net.
>
> We are in the process of determining what equipment we
would need to properly
> characterize interconnects ( at package level) with
risetimes as low as 50~100
> picosecond. We would also include differential pair
characterization as well
> since wee see the use of differential pairs at package
level more and more.
>
> If you would send some feedback on your experience with
TDR equipment, or a
> setup that works in high speed domain and provides good
repeatibility, I would
> ver much appreciate your feedback.!.
>
> Thanks in advance
> Ozgur Misman
> Sr. Engineer/scientist
>
>
>
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