Re: [SI-LIST] : Feedback needed in TDR measurements

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From: Dima Smolyansky ([email protected])
Date: Wed Feb 14 2001 - 11:50:29 PST


Jim:

There is just one minor detail: a TDR oscilloscope based solution will give
much more modeling capability, will allow more differential ports, and will
cost half as much :-).

Thanks,

===================
Dima Smolyansky
TDA Systems, Inc.
11140 SW Barbur Blvd., Suite 100
Portland, OR 97219
(503) 246-2272
(503) 246-2282 (fax)
(503) 804-7171 (mobile)
http://www.tdasystems.com
The Interconnect Modeling Company(TM)

----- Original Message -----
From: "Knighten, Jim L" <[email protected]>
To: "Offer Kaye" <[email protected]>; "Ozgur Misman"
<[email protected]>
Cc: <[email protected]>
Sent: Wednesday, February 14, 2001 9:52 AM
Subject: RE: [SI-LIST] : Feedback needed in TDR measurements

> Offer,
>
> That is a very good suggestion. Check out http://www.atn-microwave.com/
> <http://www.atn-microwave.com/> for the ATN Multiport Vector network
> analyzer solution - especially the time domain software which can emulate
> TDR techniques from frequency domain data (which have a better
> signal-to-noise characteristic).
>
> Jim
> ________________________________________________________
> Dr. Jim Knighten e-mail: [email protected]
> <[email protected]>
> Technical Consultant - Design
> NCR
> 17095 Via del Campo
> San Diego, CA 92127 http://www.ncr.com <http://www.ncr.com>
> Tel: 858-485-2537
> Fax: 858-485-3788
>
>
> -----Original Message-----
> From: Offer Kaye [mailto:[email protected]]
> Sent: Tuesday, February 13, 2001 11:15 PM
> To: Ozgur Misman
> Cc: [email protected]
> Subject: Re: [SI-LIST] : Feedback needed in TDR
> measurements
>
> Ozgur, I would also check out how VNA systems compare to TDR
> ones in these
> type of measurements.
>
> As another avenue of research I would suggest a good book,
> such
> as: "High-frequency characterization of electronic
> packaging", from
> Kluwer Academic Pub; ISBN: 0792383079.
>
> Offer Kaye
> [email protected]
> [email protected]
>
> On Tue, 13 Feb 2001, Ozgur Misman wrote:
>
> >
> >
> > Hello everyone,
> >
> > We have capital to put together a TDR analysis capability
> for high speed
> > interconnect characterization. our focus is mainly BGA,
> leadframe and high end
> > 1500+ I/O flip chip packages with interconnect length
> ranging from 2 mm to 20
> > mm. As in any package construction vias, traces,
> solderballs, chip bumps etc
> > make up a signal net.
> >
> > We are in the process of determining what equipment we
> would need to properly
> > characterize interconnects ( at package level) with
> risetimes as low as 50~100
> > picosecond. We would also include differential pair
> characterization as well
> > since wee see the use of differential pairs at package
> level more and more.
> >
> > If you would send some feedback on your experience with
> TDR equipment, or a
> > setup that works in high speed domain and provides good
> repeatibility, I would
> > ver much appreciate your feedback.!.
> >
> > Thanks in advance
> > Ozgur Misman
> > Sr. Engineer/scientist
> >
> >
> >
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