Date: Tue Nov 14 2000 - 06:44:23 PST
I don't expect you to get reliable data on the current carrying capacity of
chip bumps or solder balls for two reasons. 1) in many of the bump
technologies in use today, the factor limiting the current is not the size
of the solder connection, it is the interface between the solder and the IC.
2) since the limit is in the interface, it is usually confidential
> -----Original Message-----
> From: Ozgur Misman [mailto:firstname.lastname@example.org]
> Sent: Monday, November 13, 2000 7:03 PM
> To: email@example.com
> Subject: [SI-LIST] : current carrying capacity of chip bump and solder
> Hi Everybody,
> I was wondering if anyone had a reliable data on the current
> carrying capacity
> of chip bump (flip-chip) and solder ball with respect to
> diameter, mounted
> height, etc? If you have any information to share or can poin
> to a reliable
> reference I would appreciate it.
> Thanks in advance
> Ozgur Misman
> Sr. Engineer
> **** To unsubscribe from si-list or si-list-digest: send e-mail to
> firstname.lastname@example.org. In the BODY of message put: UNSUBSCRIBE
> si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
> si-list archives are accessible at http://www.qsl.net/wb6tpu
**** To unsubscribe from si-list or si-list-digest: send e-mail to
email@example.com. In the BODY of message put: UNSUBSCRIBE
si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
si-list archives are accessible at http://www.qsl.net/wb6tpu
This archive was generated by hypermail 2b29 : Tue May 08 2001 - 14:30:07 PDT