Date: Tue Nov 14 2000 - 06:44:23 PST
I don't expect you to get reliable data on the current carrying capacity of
chip bumps or solder balls for two reasons. 1) in many of the bump
technologies in use today, the factor limiting the current is not the size
of the solder connection, it is the interface between the solder and the IC.
2) since the limit is in the interface, it is usually confidential
> -----Original Message-----
> From: Ozgur Misman [mailto:email@example.com]
> Sent: Monday, November 13, 2000 7:03 PM
> To: firstname.lastname@example.org
> Subject: [SI-LIST] : current carrying capacity of chip bump and solder
> Hi Everybody,
> I was wondering if anyone had a reliable data on the current
> carrying capacity
> of chip bump (flip-chip) and solder ball with respect to
> diameter, mounted
> height, etc? If you have any information to share or can poin
> to a reliable
> reference I would appreciate it.
> Thanks in advance
> Ozgur Misman
> Sr. Engineer
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