From: Ozgur Misman ([email protected])
Date: Mon Nov 13 2000 - 17:03:09 PST
I was wondering if anyone had a reliable data on the current carrying capacity
of chip bump (flip-chip) and solder ball with respect to diameter, mounted
height, etc? If you have any information to share or can poin to a reliable
reference I would appreciate it.
Thanks in advance
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