Re: [SI-LIST] : bga

Roland F. Portman (portman@bitmicro.com)
Thu, 07 May 1998 10:17:39 -0700

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Motorola has a large web page on PBGAs.
Layout, assembly, rework, reliability, stress, mechanical outlines and
more.

Access!Motorola: PBGA Introduction

http://mot-sps.com/solutions/wired/pbga/pbga.html

Also look at

http://mot-sps.com/books/apnotes/pdf/an1231rev2a.pdf
Stats: 707286 bytes, Last Update: Jul 18 1997

Thanks, Jeff, for the pointer.

Roland

Jeff Seeger wrote:

> Roland F. Portman wrote:
> >
> > Do you know if there has been any research on the use of BGA's in an
>
> > Industrial
> > environment (-40C to +85C combined with moderate to severe shock and
>
> > vibration).
> > I am afraid the different tCE of the BGA and the PWB (FR4) over
> that
> > temperature
> > extreme will cause the balls to crack and fail.
>
> Two methods of miminizing the tCE issue are the use of
> Columns rather than Balls and the use of an underfill.
>
> > Perez, Raul wrote:
> >
> > > There is a Joint Industry Standard by both the IPC and the EIA on
> > > Implementation of Ball Grid Array and other High Density
> Technology.
> > >
> > > J-STD-013
> > >
> > > Check out these pages for more info.
> > > http://www.ipc.org
> > > http://www.eia.org
> > >
> An additional resource is Motorola's application note
> AN1231, available as a pdf file on their web site. Afraid
> you'll have to perform a search as I did not keep the link.
>
> Regards to all,
> --
>
> Jeff Seeger Applied CAD Knowledge
> Inc
> Chief Technical Officer Tyngsboro, MA
> 01879
> jseeger "at" appliedcad "dot" com 978 649
> 9800

--
Roland F. Portman
BiT Microsystems, Inc.
48499 Milmont Drive
Fremont, CA  94538

(510) 623-2341 Ext 129 (510) 623-2342 Fax

portman@bitmicro.com http://www.bitmicro.com

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Motorola has a large web page on PBGAs.
Layout, assembly, rework, reliability, stress, mechanical outlines and more.

 Access!Motorola: PBGA Introduction

          http://mot-sps.com/solutions/wired/pbga/pbga.html

Also look at

 http://mot-sps.com/books/apnotes/pdf/an1231rev2a.pdf
Stats: 707286 bytes, Last Update: Jul 18 1997

Thanks, Jeff, for the pointer.

Roland
 
 

Jeff Seeger wrote:

Roland F. Portman wrote:
>
> Do you know if there has been any research on the use of BGA's in an
> Industrial
> environment (-40C to +85C combined with moderate to severe shock and
> vibration).
> I am afraid the different  tCE of the BGA and the PWB (FR4) over that
> temperature
> extreme will cause the balls to crack and fail.

        Two methods of miminizing the tCE issue are the use of
        Columns rather than Balls and the use of an underfill.

> Perez, Raul wrote:
>
> > There is a Joint Industry Standard by both the IPC and the EIA on
> > Implementation of Ball Grid Array and other High Density Technology.
> >
> >         J-STD-013
> >
> > Check out these pages for more info.
> > http://www.ipc.org
> > http://www.eia.org
> >
        An additional resource is Motorola's application note
        AN1231, available as a pdf file on their web site.  Afraid
        you'll have to perform a search as I did not keep the link.

        Regards to all,
--

      Jeff Seeger                             Applied CAD Knowledge Inc
      Chief Technical Officer                      Tyngsboro, MA  01879
      jseeger "at" appliedcad "dot" com                    978 649 9800

 

--
Roland F. Portman
BiT Microsystems, Inc.
48499 Milmont Drive
Fremont, CA  94538

(510) 623-2341 Ext 129
(510) 623-2342 Fax

portman@bitmicro.com
http://www.bitmicro.com
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