Re: [SI-LIST] : skin effect and transmission line simulators

Dr. Edward P. Sayre (esayre@nesa.com)
Mon, 8 Sep 1997 19:27:34 -0400

Funny you should mention this. This is exactly the problem in estimating
the footprint effects we have seen in BGA dispersion problems. Having the
package paramters is only half the problem. Who will provide the rest of
the circuit information for packaging?

ed sayre

At 11:20 AM 9/5/97 -0400, you wrote:
>
>
>On Thu, 4 Sep 1997, Al Barber wrote:
>
>> Chris Simon wrote:
>> >
>>
>> > The simulator I'm looking for should include all of the following:
>> ....
>> >
>> > I would be interested in hearing which of the above criteria are met by
>> > other tools, or whether a future revision will incorporate these >features.
>>
>> There is an additional feature I'm surprised you don't mention. How
>> about crosstalk among multiple lines?
>>
>> Al Barber
>> Hewlett Packard Labs
>>
>
>Crosstalk not only appears between multiple parallel lines, but also
>between vias. Our recent study shows that electromagnetic coupling between
>vias is often as significant as or sometimes even more significant than
>the coupling between parallel traces. A signal integrity software tool is
>better to be able to accurately model the coupling between multiple lines,
>vias, as well as the voltage fluctuations in the power and ground supply
>systems.
>
>
>Jiayuan Fang
>SUNY-Binghamton
>
>
>

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