RE: 3.3V/5V planes

Peterson, James F (jfpeterson@space.honeywell.com)
Thu, 17 Jul 1997 12:20:59 -0400

i didn't think you could do a 9 layer board - it would have to be either
8 or 10. anyway, how about a dual-stripline approach, where you would
sandwich 2 signal layers in between power/gnd planes? (this seems to
keep the crosstalk level down and also might give you 1 or 2 more signal
layers :
1---top
2---gnd
3---sig
4---sig
5---+5V
6---sig
7---sig
8---gnd
9---+3v
10-bottom

> ----------
> From: fabrizio
> zanella[SMTP:fabrizio=zanella%Eng%EMCHOP1@fishbowl02.lss.emc.com]
> Sent: Thursday, July 17, 1997 10:54 AM
> To: si-list@silab.Eng.Sun.COM
> Subject: 3.3V/5V planes
>
> Stuart, I would recommend a more symmetrical stackup for your board
> with
> one extra layer. With this stackup every signal layer references a
> ground
> layer, and the board is more manufacturable.
>
> 1 -------------- top
> 2 -------------- signal
> 3 -------------- ground
> 4 --------------- +5V
> 5 --------------- signal
> 6 --------------- ground
> 7 --------------- signal
> 8 --------------- +3V
> 9 --------------- bottom
>
> Regards,
>
> Fabrizio Zanella
>
> Sr. Design Engineer
>
> Hardware Engineering
> _/ _/ email:
> zanella_fabrizio@emc.com
> _/_/_/_/ _/ _/ _/_/_/ _/ voice: (508) 435-1000
> Ext.
> 4645
> _/ _/_/ _/_/ _/ _/ Fax: (508) 435-8949
> _/_/_/_/ _/ _/ _/ _/ _/_/_/
> _/ _/ _/ _/ EMC Corporation
> _/_/_/_/ _/ _/ _/_/_/ 171 South Street
> Hopkinton, MA
> 01748-9103
>
>