RE: [SI-LIST] : Broadside v edge coupled striplines

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From: cadpro2k@dacafe.com
Date: Mon Jan 22 2001 - 08:58:15 PST


Hi Ron,

Could you provide me the details please? Also, what tool are you using
to do your differential impedance calcs? I'm using Polar's CITS tool,
but is there a better one? And, any additional references you have to DI
would be appreciated.

Thank you.

Mitch Morey
Sr PCB Designer
San Diego, CA

---------Included Message----------
> Date: Fri, 19 Jan 2001 17:18:08 -0800
> From: "Ron Miller" <rmiller@brocade.com>
> Reply-To: "Ron Miller" <rmiller@brocade.com>
> To: "'Scott McMorrow'" <scott@vasthorizons.com>,
<Aubrey_Sparkman@Dell.com>
> Cc: <ldmiller@rhapsodynetworks.com>,
<ribrooks@nortelnetworks.com>, <SI-LIST@silab.eng.sun.com>
> Subject: RE: [SI-LIST] : Broadside v edge coupled striplines
>
> Hi scott
>
> Broadside lines require more real estate than edge coupled
> lines. If you have the real estate that is good. We do not.
>
> If you disagree the contention that broadside requires more
> real estate please e-mail me and I will fill in the details.
>
> ron Miller
>
> -----Original Message-----
> From: Scott McMorrow [mailto:scott@vasthorizons.com]
> Sent: Friday, January 19, 2001 10:00 AM
> To: Aubrey_Sparkman@Dell.com
> Cc: ldmiller@rhapsodynetworks.com; ribrooks@nortelnetworks.com;
> SI-LIST@silab.eng.sun.com
> Subject: Re: [SI-LIST] : Broadside v edge coupled striplines
>
>
> Aubrey,
>
> The manufacturing issues can be reduced by constructing the
> broadside pair on core material and keeping the spacing between
> the pairs small compared to the spacing to the planes. Then the
> separation between the pair is well controlled and the fields
are
> well contained between the pairs.
>
> Another solution which works quite well is to use CPW or
> grounded CPW construction for diff pairs on outer layers.
>
>
> regards,
>
> scott
>
> --
> Scott McMorrow
> Principal Engineer
> SiQual, Signal Quality Engineering
> 18735 SW Boones Ferry Road
> Tualatin, OR 97062-3090
> (503) 885-1231
> http://www.siqual.com
>
>
> Aubrey_Sparkman@Dell.com wrote:
>
> > Thanks for that correction. Isn't the difference is really in
> > manufacturing, not physics? An EDGE-coupled diff pair is more
uniform
> > because the pattern is etched in the same process. The
BROADSICE-coupled
> > diff pair is etched at two different times and additionally has
to be
> > mechanically aligned for lamination. This adds two additional
error terms
> > to the accuracy of your BROADSICE-coupled diff pair that the
EDGE-coupled
> > diff pair does not have. So IMHO, you should really have a
packing density
> > problem before you consider using BROADSICE-coupled traces.
> >
> > But if you are doing work for Compaq or Sun, you should use
> > BROADSICE-coupled diff pairs whenever possible. :-)
> >
> > Aubrey Sparkman
> > Signal Integrity
> > Aubrey_Sparkman@Dell.com
> > (512) 723-3592
> >
> >
> >
>
>
>
>
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