[SI-LIST] : SI position at Broadcom

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From: Matt Kaufmann (mkaufmann@broadcom.com)
Date: Tue Jan 16 2001 - 12:40:08 PST


Broadcom Corporation is looking for talented, motivated, and committed
Signal Integrity engineers to do electrical modeling, simulation, and design
of advanced packages for high speed devices. This job requires an individual
with outstanding electrical simulation and performance characterization
skills who is able to perform detailed electrical analysis on high
performance advanced packages for the leader in communications
semiconductors. Must be willing to work in aggressive growth environment and
provide leadership and guidance as part of a leading edge electronic package
development and implementation team.

Package Characterization and Signal Integrity Engineer:
-Responsible for electrical package modeling, characterization, and design
of advanced, high performance digital, analog, and RF packages (BGAs,
flipchip, wafer-level packaging, chip-scale packages, multi-chip modules,
Bluetooth).
-Signal integrity analysis of power/ground distribution design, package
resonance, interconnect delay, differential signaling, crosstalk, and
reflection noise
-Work closely with IC designers, customers, and suppliers to optimize
component electrical performance
-Evaluate and implement analysis tools/methodologies for efficient, accurate
signal integrity analyses

Desired Experience:
-BS/MS in Electrical Engineering
-Sound understanding of electromagnetic theory and fundamentals
-At least two years experience with electrical modeling tools such as
ANSOFT, Speed2000, HFSS, and other tools
-Experience with IBIS and SPICE modeling highly desirable
-Hands-on experience with experimental methods such as TDR and S-parameter
measurement
-Excellent project planning and communication skills
-Works well in a team environment

The location can be in the either the Bay Area (Mountain View or Santa
Clara) or Irvine, CA.

Please contact me if you or anyone you know may be interested.

Regards,

Matt Kaufmann
Principal Engineer
IC Assembly and Packaging Development
Broadcom Corporation
777 East Middlefield Road
Mountain View, CA 94043-4005
650-567-7824
408-464-9354 (cell/pager)
650-940-7770 (fax)
mkaufmann@broadcom.com

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