RE: [SI-LIST] : Power Plane Inductance

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From: Aubrey_Sparkman@Dell.com
Date: Thu Jul 13 2000 - 14:42:03 PDT


Doug,
Do you really believe the inductance of a connection that is 0.5'(feet?) to
1.0"(inch) from via to cap is negligable in all cases? Don't you think the
connection method makes a difference? IE, thin trace VS unbroken planes.

Aubrey Sparkman
Signal Integrity
Aubrey_Sparkman@Dell.com
(512) 723-3592

> -----Original Message-----
> From: Doug Brooks [mailto:doug@eskimo.com]
> Sent: Thursday, July 13, 2000 12:08 PM
> To: Moran, Brian P; si-list@silab.eng.sun.com
> Subject: Re: [SI-LIST] : Power Plane Inductance
>
>
> At 02:19 PM 7/12/00 -0700, you wrote:
> >Hi All,
> >
> >I am trying to do some back of the envelope power delivery
> analysis, and I
> >need a number for inductance from a BGA package pad pin escape, to a
> >decoupling capacitor, located 0.5' to 1.0" from the via site.
>
>
> Well, my "back of the envelope" answer is that whatever it is, it is
> negligible compared to the rest of the path and can be ignored!
>
> Doug Brooks
>
> .
> ************************************************************
> Doug Brooks' book "Electrical Engineering for the Non-Degreed
> Engineer" is now available. See our web site for details.
> .
> Doug Brooks, President doug@eskimo.com
> UltraCAD Design, Inc. http://www.ultracad.com
>
>
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