From: Adrian Shiner (email@example.com)
Date: Thu Mar 09 2000 - 12:17:37 PST
From another "Dinosaur"
Using boards which are small but very thin (less than .062) presents
problems for handling in manufacture and transportation. It is possible for
flexure of the board to crack surface mount devices (SMDs) such as
capacitors and resistors. I know this from experience..Cracked SMD devices
work and then they don't and then they work....................
----- Original Message -----
From: "Cusanelli, Tony" <Tony_Cusanelli@mentorg.com>
Sent: 09 March 2000 11:08
Subject: RE: [SI-LIST] : why .062?
> A few people asked for the "old guys" to comment on why boards are .062.
> Back in the dark ages (30 yrs ago) the boards I first designed were merely
> mechanical devices that supported parts. Connectivity was accomplished via
> wire-wrap. Parts were heavy and boards had to be thick enough to prevent
> breakage, but thin enough to carry. 1/16 inch became the right
> and card guides, standard socket boards and chassis were all designed to
> that thickness.
> Even with today's lighter parts, tracks are thin and need some support.
> .032 boards are okay if they are small. Flexing and the pressure from
> connector insertion/extraction will fracture thin traces.
> PS - for you young guys - wire wrap was accomplished with a device similar
> to a hollow drill bit that would wrap 6-8 turns of 30 awg wire around a
> square or rectangular post. The edges would bite into the wire and make a
> gas-tight connection that was tested with a pull device (strain gauge).
> had some PC boards, but they were mostly 2 and four layer. Draftsmen
> could not lay out a board as fast as I could write a wirelist for the
> Yes now I feel like a dinosaur.
> -----Original Message-----
> From: Alex Li [mailto:firstname.lastname@example.org]
> Sent: Monday, March 06, 2000 9:36 PM
> To: 'email@example.com'
> Subject: [SI-LIST] : different 4-layer board Stack up (S-P-G-S) ?
> Recently I saw a 4-layer mother board with 100 Mhz 128-bit memory bus.
> This board has unusual signal-power-ground-signal stack up. I talked to
> one of their engineer for this kind of arrangement. They said since most
> motherboard has several power plane split and on the top level there are a
> lot of components with pads. they think if they route all the 128-bit
> bus on the back and put it close to ground plane, they have much routing
> area and this will help to keep the signals clean.
> This is kind of new idea to me, does anyone see any drawback by this
> arrangement ? Will this decrease the decoupling caps performance ?
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