RE: [SI-LIST] : Of thermal reliefs and signal integrity....

Dave Hoover (dhoover@mccurdy.com)
Wed, 13 Oct 1999 15:05:48 -0700

Dave....(aka, Groovy)

-----Original Message-----
From: Mitch Morey [mailto:cadpro2K@DACafe.com]
Sent: Wednesday, October 13, 1999 2:29 PM
To: si-list@silab.eng.sun.com
Subject: Re: [SI-LIST] : Of thermal reliefs and signal integrity....

Not a chance. I've been using direct connects to the plane layer for a
half dozen years or more, and I've never been told it's either
unmanufacturable to that the spokes are necessary for signal integrity.
The only holes I relieve are the ones that will be soldered to. A direct
connect is much better connection as far as integrity issues from what I
understand.

More and more horse-puky!

Mitch morey
San Diego
CadPro2K@dacafe.com

(the 70s and 80s are over, have it your way!)
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