Mark
At 02:39 PM 10/13/99 -0400, you wrote:
>I was hoping that somebody out there might have a report
>that can help me out. I know that I can find it but it also
>might be useful to others facing a similar problem. Under
>the guise of this is always that it has been done and we
>can't build boards otherwise (technical data conspicuously
>absent). I am being told that all power plane connections
>even SMT devices are connected to the plane via thermal
>reliefs (four spoke I suppose)
>
>Not only is this unnecessary in that the thermal drop of the
>escape etch of the SMT pad should be the same or better
>than four spokes, but inductance to the power plane is
>increased and the power plane is chopped up, especially
>in high density BGA areas where you need it the most.
>
>If you have a report that shows this, or think that I am off
>my rocker, please post as I imagine that many folks reading
>this may be in a similar situation.
>
>Thanks,
>
>Michael
>
>The bounds of Time, Space or Mechanics should never stand
>in the way of a perfectly good idea.......
>
>The time is gone, The email's over, thought I'd
>something more to say.........
>
>Michael C. Greim Consulting Engineer
>Mercury Computer Systems, Inc email: [email protected]
>199 Riverneck Road V: 978-256-0052/x1607
>Chelmsford, MA 01824-2820 F: 978-256-4778
>
>
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