Re: [SI-LIST] : BGA vs Leaded package electrical performance

Ron Miller (rmiller@Brocade.COM)
Thu, 04 Mar 1999 14:30:28 -0800

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Hi guys

In order to understand and to simulate the CQFP and CBGA packages the
frequency domain is the best way to go because all lead inductances also have
distributed capacitance. Frequency domain models of transmission lines are
as close to reality as we can get, and are available only in frequency domain
simulators. Some of these simulators also have FFTs and convolution to get
back to the time domain for waveform analysis.

So, do not get hung up on inductance and capacitance only. There is more than
meets the eye.

Ron Miller

ajmani@us.ibm.com wrote:

> A paper titled "Noise Computation in Single Chip Packages" by Bathey,
> Swaminathan, Smith, and Cockerill, published in IEEE Transactions on
> Components, Packaging, and Manufacturing Technology-Part B, Vol. 19, May
> 1996, compares the performance of a CQFP package with a CBGA package.
>
> Regards, Ravinder
> PCB Development and Design Department
> IBM Corporation - Storage Systems Division
> ***************************************************************************
> Always do right. This will gratify some people and astonish the rest.
> .... Mark Twain
>
> greg kimball <gkimball@indra.com> on 03/03/99 12:26:07 AM
>
> To: si-list@silab.Eng.Sun.COM
> cc: (bcc: Ravinder Ajmani/San Jose/IBM)
> Subject: [SI-LIST] : BGA vs Leaded package electrical performance
>
> Has anyone done or know of any work done to compare the electrical
> transmission capabilities of these two interconnect technologies?
> Specifically, the parasitic series inductance difference between a 48
> pin TQFP and BGA for example. Also, measurement methodologies to make a
> in situ comparison.
> Greg Kimball
> TI Storage Product Div.
>
> **** To unsubscribe from si-list: send e-mail to
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--
Ronald B. Miller  _\\|//_  Signal Integrity Engineer
(408)487-8017    (' 0-0 ') fax(408)487-8017
     ==========0000-(_)0000===========
Brocade Communications Systems, 1901 Guadalupe Parkway, San Jose, CA  95131
rmiller@brocade.com,  rbmiller@sjm.infi.net

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<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN"> Hi guys

In order to understand and to simulate the CQFP and CBGA packages the
frequency domain is the best way to go because all  lead inductances also have
distributed capacitance.  Frequency domain models of transmission lines are
as close to reality as we can get, and are available only in frequency domain
simulators.  Some of these simulators also have FFTs and convolution to get
back to the time domain for waveform analysis.

So, do not get hung up on inductance and capacitance only.  There is more than
meets the eye.

Ron Miller

ajmani@us.ibm.com wrote:

A paper titled "Noise Computation in Single Chip Packages" by Bathey,
Swaminathan, Smith, and Cockerill, published in IEEE Transactions on
Components, Packaging, and Manufacturing Technology-Part B, Vol. 19, May
1996, compares the performance of a CQFP package with a CBGA package.

Regards, Ravinder
PCB Development and Design Department
IBM Corporation - Storage Systems Division
***************************************************************************
Always do right.  This will gratify some people and astonish the rest.
.... Mark Twain

greg kimball <gkimball@indra.com> on 03/03/99 12:26:07 AM

To:   si-list@silab.Eng.Sun.COM
cc:    (bcc: Ravinder Ajmani/San Jose/IBM)
Subject:  [SI-LIST] : BGA vs Leaded package electrical performance

Has anyone done or know of any work done to compare the electrical
transmission capabilities of these two interconnect technologies?
Specifically, the parasitic series inductance difference between a 48
pin TQFP and BGA for example. Also, measurement methodologies to make a
in situ comparison.
Greg Kimball
TI Storage Product Div.

**** To unsubscribe from si-list: send e-mail to
majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE
si-list, for more help, put HELP.  si-list archives are accessible at
http://www.qsl.net/wb6tpu/si-list ****

**** To unsubscribe from si-list: send e-mail to majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE si-list, for more help, put HELP.  si-list archives are accessible at http://www.qsl.net/wb6tpu/si-list ****

-- 
Ronald B. Miller  _\\|//_  Signal Integrity Engineer
(408)487-8017    (' 0-0 ') fax(408)487-8017                 
     ==========0000-(_)0000=========== 
Brocade Communications Systems, 1901 Guadalupe Parkway, San Jose, CA  95131
rmiller@brocade.com,  rbmiller@sjm.infi.net
  --------------A5F3D131FB5FFB5EDE0622BD-- **** To unsubscribe from si-list: send e-mail to majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE si-list, for more help, put HELP. si-list archives are accessible at http://www.qsl.net/wb6tpu/si-list ****