Re: [SI-LIST] : BGA vs Leaded package electrical performance

ajmani@us.ibm.com
Wed, 3 Mar 1999 09:33:12 -0700

A paper titled "Noise Computation in Single Chip Packages" by Bathey,
Swaminathan, Smith, and Cockerill, published in IEEE Transactions on
Components, Packaging, and Manufacturing Technology-Part B, Vol. 19, May
1996, compares the performance of a CQFP package with a CBGA package.

Regards, Ravinder
PCB Development and Design Department
IBM Corporation - Storage Systems Division
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greg kimball <gkimball@indra.com> on 03/03/99 12:26:07 AM

To: si-list@silab.Eng.Sun.COM
cc: (bcc: Ravinder Ajmani/San Jose/IBM)
Subject: [SI-LIST] : BGA vs Leaded package electrical performance

Has anyone done or know of any work done to compare the electrical
transmission capabilities of these two interconnect technologies?
Specifically, the parasitic series inductance difference between a 48
pin TQFP and BGA for example. Also, measurement methodologies to make a
in situ comparison.
Greg Kimball
TI Storage Product Div.

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