[SI-LIST] : Board stackup

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From: Hassan Ali (hali@lanterncom.com)
Date: Thu May 24 2001 - 12:46:42 PDT


Hi All, (and NOT just SI Gurus ;-))

Could anyone point me to a primer or provide me with guidelines on how best
to decide on board stackup issues such as:

- number of layers, layer heights, layout of layers (signal, ground, power,
etc.)
- board material (FR4, GETEK, etc.),
- dimensions of single-ended and differential-pair transmission lines (trace
width, trace thickness, trace spacing, etc.),
- via types (through-hole, blind, buried, microvia, etc.) and via sizes
(including pad/anti-pad sizes, hole size, trace-pad clearance, etc.)

Thanks in advance.

Hassan.

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