Re: [SI-LIST] : Board stackup

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From: Martyn Gaudion (martyn.gaudion@polarinstruments.com)
Date: Thu May 24 2001 - 14:28:27 PDT


Dear Hassan,

A good place is to talk with the apps engineers of your
PCB fabricator, -if they are not familiar with most economic
stack for your high frequency application then it is probably
time to find a shop that is..

You can find a primer on controlled impedance covering
differential traces and other high frequency issues at:

http://www.polarinstruments.com/support/cits/Controlled%20impedance%20booklet%20586K.pdf

Hope this helps

Kind regards
Martyn Gaudion
www.polarinstruments.com

At 20:46 24/05/2001, you wrote:
>Hi All, (and NOT just SI Gurus ;-))
>
>Could anyone point me to a primer or provide me with guidelines on how best
>to decide on board stackup issues such as:
>
>- number of layers, layer heights, layout of layers (signal, ground, power,
>etc.)
>- board material (FR4, GETEK, etc.),
>- dimensions of single-ended and differential-pair transmission lines (trace
>width, trace thickness, trace spacing, etc.),
>- via types (through-hole, blind, buried, microvia, etc.) and via sizes
>(including pad/anti-pad sizes, hole size, trace-pad clearance, etc.)
>
>Thanks in advance.
>
>Hassan.
>
>
>
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