From: Zabinski, Patrick J. ([email protected])
Date: Mon May 21 2001 - 12:04:28 PDT
If there is a definitive answer, I'd like to hear it as well.
I've seen vendors rate their packages' power handling ability
on such things as:
* how hot can it get before it delaminates/melts;
* thermal conductivity between die attach area to backside;
* simple surface are of package backside; and/or
* what's the hottest chip someone has ever put in their package.
If there is some industry-standard along these lines, I'd like to
> A seemingly trivial question: how to verify how much power a
> package can
> handle? Is it power cycling? Or Device functional testing? Or else?
> Any suggestions?
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