From: Zabinski, Patrick J. (firstname.lastname@example.org)
Date: Mon May 21 2001 - 12:04:28 PDT
If there is a definitive answer, I'd like to hear it as well.
I've seen vendors rate their packages' power handling ability
on such things as:
* how hot can it get before it delaminates/melts;
* thermal conductivity between die attach area to backside;
* simple surface are of package backside; and/or
* what's the hottest chip someone has ever put in their package.
If there is some industry-standard along these lines, I'd like to
> A seemingly trivial question: how to verify how much power a
> package can
> handle? Is it power cycling? Or Device functional testing? Or else?
> Any suggestions?
**** To unsubscribe from si-list or si-list-digest: send e-mail to
email@example.com. In the BODY of message put: UNSUBSCRIBE
si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
si-list archives are accessible at http://www.qsl.net/wb6tpu
This archive was generated by hypermail 2b29 : Thu Jun 21 2001 - 10:12:03 PDT