RE: [SI-LIST] : Package power rating

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From: Zabinski, Patrick J. (zabinski.patrick@mayo.edu)
Date: Mon May 21 2001 - 12:04:28 PDT


Yuan,

If there is a definitive answer, I'd like to hear it as well.

I've seen vendors rate their packages' power handling ability
on such things as:

        * how hot can it get before it delaminates/melts;
        * thermal conductivity between die attach area to backside;
        * simple surface are of package backside; and/or
        * what's the hottest chip someone has ever put in their package.

If there is some industry-standard along these lines, I'd like to
see it.

Pat

> A seemingly trivial question: how to verify how much power a
> package can
> handle? Is it power cycling? Or Device functional testing? Or else?
>
> Any suggestions?
>
> Thanks,
>
> Yuan
>

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