From: Ritchey Lee (firstname.lastname@example.org)
Date: Tue May 15 2001 - 05:21:10 PDT
First, right anlge bends don't represent a yield problem at PCB fabrication and
haven't since we stopped imaging with silk screen etch resists.
The real issue is that design departments often spend extra time making right
angle bends go away by "smoothing" the routed results. This extra time should
have an offsetting benefit. It doesn't.
Even worse, many companies have discarded cad systems because they cannot be
prevented from putting right angle bends in artwork. That is a real big cost
without an offsetting benefit.
> Right angle bends are:
> A very high frequency, essentially microwave, effect. Provided you have low
> voltages. Part of the concern is a legacy of higher voltages associated with
> discrete BJTs, and before that, vacume tube RF circuits.
> But, I understand chamfered or radius bends give better fab yields. So, what's
> the real issue other than refining a rule of thumb?
> **** To unsubscribe from si-list or si-list-digest: send e-mail to
> email@example.com. In the BODY of message put: UNSUBSCRIBE
> si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
> si-list archives are accessible at http://www.qsl.net/wb6tpu
**** To unsubscribe from si-list or si-list-digest: send e-mail to
firstname.lastname@example.org. In the BODY of message put: UNSUBSCRIBE
si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
si-list archives are accessible at http://www.qsl.net/wb6tpu
This archive was generated by hypermail 2b29 : Thu Jun 21 2001 - 10:11:58 PDT