From: D. C. Sessions (firstname.lastname@example.org)
Date: Mon Apr 16 2001 - 18:10:41 PDT
On Monday 16 April 2001 17:14, Saeen Malik wrote:
> Hello Gurus,
> Is there a way to estimate the power/ground bounce inside the chip
> i.e. before the package parasitics. I have run some simulations but now
> I want to correlate the results using measurements.
I presume you're talking about labwork. In that case, it's pretty
important to have some Kelvin contacts. Undriven, unloaded connections.
For I/O this can be approximated by quiescent outputs. For core you
pretty well have to isolate a power/ground pair.
> Secondly, I always thought that the power supply ripple would appear
> on the signal while driving high e.g. if there is a dip in the supply there
> should be a corresponding dip in the output signal. Well my measurements do
> not indicate that. Am I missing something?
Core supply or ring?
-- | The race is not always to the swift, nor the battle to the strong. | | Because the slow, feeble old codgers like me cheat. | +--------------- D. C. Sessions <email@example.com> --------------+
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This archive was generated by hypermail 2b29 : Thu Jun 21 2001 - 10:11:36 PDT