From: Saeen Malik ([email protected])
Date: Mon Apr 16 2001 - 17:14:35 PDT
Is there a way to estimate the power/ground bounce inside the chip
i.e. before the package parasitics. I have run some simulations but now
I want to correlate the results using measurements.
Secondly, I always thought that the power supply ripple would appear
on the signal while driving high e.g. if there is a dip in the supply there
should be a corresponding dip in the output signal. Well my measurements do
not indicate that. Am I missing something?
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This archive was generated by hypermail 2b29 : Thu Jun 21 2001 - 10:11:36 PDT