[SI-LIST] : FW: IMAPS -- Future Digital Interconnects Over 1,000 MHz

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From: Eric Bogatin (eric@bogent.com)
Date: Thu Dec 23 1999 - 10:48:40 PST


Hi folks-

I have forwarded the note below announcing the IMAPS workshop of Future
Digital Interconnects over 1GHz. All are invited to attend. See you there!

--eric

Eric Bogatin
BOGATIN ENTERPRISES
Training for Signal Integrity and Interconnect Design
26235 W. 110th Terr.
Olathe, KS 66061
v: 913-393-1305
f: 913-393-1306
pager: 888-775-1138
e: eric@bogent.com
web: <http://www.bogatinenterprises.com/>

-----Original Message-----
From: Don Brown [mailto:dbbrown2@ix.netcom.com]
Sent: Friday, December 17, 1999 8:55 AM
To: Don Brown
Subject: IMAPS -- Future Digital Interconnects Over 1,000 MHz

2nd Announcement...
2nd Annual IMAPS Advanced Technical Workshop

Future Digital Interconnects
over 1,000 MHz

January 17-18, 2000 Austin, TX

Pre-Registration Deadline: Dec 31, 1999

Please forward this email message
to your interested colleagues, suppliers and customers

Conference and registration details can be found at:
http://www.iwpc.org/imaps_1000_mhz.htm

Dear Colleague:

By overwhelming demand, The International Microelectronics and Packaging
Society, IMAPS, is proud to announce its 2nd Annual Advanced Technical
Workshop on

Future Digital Interconnects Over 1,000 MHz

January 17-18, 2000, Austin, TX.

Conference and registration details can be found at:
http://www.iwpc.org/imaps_1000_mhz.htm

High Speed Digital Interconnects are becoming an increasingly important part
of new product development. What are the implications for all levels of
packaging?

IMAPS' 2nd Annual Advanced Technical Workshop (ATW) on this topic wishes to
outline the problem for future developments.

Future microprocessors will have on-chip clock speeds of > 1,000 MHz, off
chip clock speeds of 100's of MHz, with 1,000's of I/O's dissipating 100's
of watts.

This new reality challenges the design, materials, packaging, manufacturing,
assembly and test community to manage high speed digital signal integrity
like never before.

The tradeoffs for clear signal integrity of decoupling capacitance,
attenuation, density, thermal management, cost, time to market are all
daunting.

This IMAPS (ATW) will bring together a diverse group of professionals from
all disciplines to define the state of the art and identify gaps which need
filling.

Session Topics Include:
   System/Bus/Network Level Issues
   GHz Microprocessor Packaging
   Thermal Issues
   Design Tools and Modeling
   GHz Connectors
   Testing

Who should attend?

        ** Decision makers who now or plan to use high speed digital devices
and packaging in product designs.

        ** Decision makers who provide GHz speed equipment, materials,
components, tools or services.

Come join and interact with some of the leading scientists and engineers in
the world to address the future in high speed digital packaging interconnect
technology. This is the "real technical deal" !!

Questions, please call or email Program Chairs,

Co-General Chair: Don Brown, Director, International Wireless
Packaging Consortium, IWPC (TEL: 215-491-2113, donbrown@iwpc.org),

Co-General Chair: Dr. Samuel Horowitz, Marketing Manager, Microcircuit
Materials, (TEL: 919-248-5752, samuel.j.horowitz@usa.dupont.com),

Technical Chair: Rick Sigliano, Kyocera Amercia, General Manager,
Advanced Technology Development (TEL: 619-576-2600,
rick.sigliano@kyocera.com)

To register, please call IMAPS Office, at 1-888-GO-IMAPS

========================================
Don Brown, Director
IWPC
1745 Appaloosa Rd.
Warrington, PA 18976 USA
TEL: 215-491-2113
FAX: 215-491-2115
Mobile: 215-688-1469
Email: donbrown@iwpc.org
WEB: http://www.iwpc.org
========================================

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