I am involved in a project where we must apply the technique of
"Picket Fence" (Via Fence) for increasing isolation between
conductors on a PCB.
I cannot find any refercnes (papers, books, etc.) on that issue. Are
you familiar with anything on that issue? The problem, basically, is
- how much isolation can we get between conductors embedded between
ground planes, or between ground and power planes, when they are
"isolated" by a "picket/via fence".
If you have come across such material, or references, I would be
grateful if you could refer me to them. I have gone through the
"classics" and could find nothing there, and I need some references
for the work we are involved in...
Elya B. Joffe - EMC Engineer
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