RE: [SI-LIST] : Call for presentations, 3-D packaging advanced te

Lyke James Civ AFRL/VSSE (lyke@plk.af.mil)
Thu, 29 Jul 1999 17:26:28 -0600

Very LITTLE signal integrity work has been on 3-D packaging. One of the
reasons I posted here was in hopes of getting someone who did. Thanks for
your observations,
jim

-----Original Message-----
From: Gregg Fokken [mailto:fokken.gregg@mayo.edu]
Sent: Wednesday, July 21, 1999 7:13 AM
To: si-list@silab.eng.sun.com
Subject: Re: [SI-LIST] : Call for presentations, 3-D packaging advanced
technology workshop

Has anyone out there done this time of
thing and seen measured results? Thanks in advance for any feedback.

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Gregg Fokken                Internet(email):  fokken.gregg@mayo.edu
Mayo Foundation                       Phone:  (507) 284-5692
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Rochester, MN  55905  


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