[SI-LIST] : Bonding options to short Busses on a die

R.S. Krishnan (rsk@cypress.com)
Thu, 17 Jun 1999 19:08:01 +0531

Hi,

I am investigating options to short power / ground busses using
bonding techniques rather than having to tape out another mask.

I would also appreciate information on vendors, cost, and commercial
viability of the method.

The die is bondable to 56/48pin SSOP plastic package.

Thanks in advance for any help
Krishnan

**** To unsubscribe from si-list: send e-mail to majordomo@silab.eng.sun.com. In the BODY of message put: UNSUBSCRIBE si-list, for more help, put HELP. si-list archives are accessible at http://www.qsl.net/wb6tpu/si-list ****