From: Zabinski, Patrick J. ([email protected])
Date: Tue Mar 20 2001 - 04:12:55 PST
IEEE has a service that can you reprints from any of their
journals and/or proceedings. Simply send an e-mail to [email protected]
If you use their service regularly, you can (often) set up an
> Hi all.
> Can someone send me the following paper?
> Q. Yu, O. Wing : "SPICE simulation of VLSI interconnects modeled by
> transmission lines with skin effects", Proceedings of IEEE Electrical
> Performance of Electronic Packaging, 20-22 october 1993
> I have not the possibility to obtain it from my library.
> Thanks and regards
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