From: Ricchiuti Vittorio ([email protected])
Date: Tue Mar 20 2001 - 02:37:43 PST
Can someone send me the following paper?
Q. Yu, O. Wing : "SPICE simulation of VLSI interconnects modeled by
transmission lines with skin effects", Proceedings of IEEE Electrical
Performance of Electronic Packaging, 20-22 october 1993
I have not the possibility to obtain it from my library.
Thanks and regards
ing. Vittorio Ricchiuti
CAD support and SI engineer
e-mail: [email protected]
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