From: [email protected]
Date: Mon Jan 22 2001 - 08:58:15 PST
Hi Ron,
Could you provide me the details please? Also, what tool are you using
to do your differential impedance calcs? I'm using Polar's CITS tool,
but is there a better one? And, any additional references you have to DI
would be appreciated.
Thank you.
Mitch Morey
Sr PCB Designer
San Diego, CA
---------Included Message----------
> Date: Fri, 19 Jan 2001 17:18:08 -0800
> From: "Ron Miller" <[email protected]>
> Reply-To: "Ron Miller" <[email protected]>
> To: "'Scott McMorrow'" <[email protected]>,
<[email protected]>
> Cc: <[email protected]>,
<[email protected]>, <[email protected]>
> Subject: RE: [SI-LIST] : Broadside v edge coupled striplines
>
> Hi scott
>
> Broadside lines require more real estate than edge coupled
> lines. If you have the real estate that is good. We do not.
>
> If you disagree the contention that broadside requires more
> real estate please e-mail me and I will fill in the details.
>
> ron Miller
>
> -----Original Message-----
> From: Scott McMorrow [mailto:[email protected]]
> Sent: Friday, January 19, 2001 10:00 AM
> To: [email protected]
> Cc: [email protected]; [email protected];
> [email protected]
> Subject: Re: [SI-LIST] : Broadside v edge coupled striplines
>
>
> Aubrey,
>
> The manufacturing issues can be reduced by constructing the
> broadside pair on core material and keeping the spacing between
> the pairs small compared to the spacing to the planes. Then the
> separation between the pair is well controlled and the fields
are
> well contained between the pairs.
>
> Another solution which works quite well is to use CPW or
> grounded CPW construction for diff pairs on outer layers.
>
>
> regards,
>
> scott
>
> --
> Scott McMorrow
> Principal Engineer
> SiQual, Signal Quality Engineering
> 18735 SW Boones Ferry Road
> Tualatin, OR 97062-3090
> (503) 885-1231
> http://www.siqual.com
>
>
> [email protected] wrote:
>
> > Thanks for that correction. Isn't the difference is really in
> > manufacturing, not physics? An EDGE-coupled diff pair is more
uniform
> > because the pattern is etched in the same process. The
BROADSICE-coupled
> > diff pair is etched at two different times and additionally has
to be
> > mechanically aligned for lamination. This adds two additional
error terms
> > to the accuracy of your BROADSICE-coupled diff pair that the
EDGE-coupled
> > diff pair does not have. So IMHO, you should really have a
packing density
> > problem before you consider using BROADSICE-coupled traces.
> >
> > But if you are doing work for Compaq or Sun, you should use
> > BROADSICE-coupled diff pairs whenever possible. :-)
> >
> > Aubrey Sparkman
> > Signal Integrity
> > [email protected]
> > (512) 723-3592
> >
> >
> >
>
>
>
>
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