# RE: [SI-LIST] : Current flow limit for wire bonding

From: Doug Brooks ([email protected])
Date: Tue Oct 10 2000 - 14:22:18 PDT

As an interesting side note to this discussion, in my seminar on this topic
I present an equation for relating temp rise and current, etc (same as in
the article) and calculate what the current would have to be to raise the
trace temperature to the melting point. Such a calculation is reckless
because it projects WAY outside the range of the data. The resulting
calculation was so close to the number from Preece's equation that the word
"dry lab" quickly came to mind!

Doug

At 06:50 PM 10/9/00 -0700, you wrote:
>Bob, Doug, John, and Won,
>
>Thank you for your reply. These are very helpful for my work.
>Bob, I have a question regarding the constant term you gave.
>You mentioned k = 30,000 or 20,500 for copper. This is quite different
>than that from Doug Brooks' papers and Standard Handbook for
>Electrical Engineers (http://home.earthlink.net/~jimlux/hv/fuses.htm).
>They suggested k = 10,244 (d in inches) or 80 (d in mm) for copper.
>Could you please confirm this?
>
>Brian Seol
>Tessera Inc.

.
************************************************************
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Engineer" is now available. See our web site for details.
.
Doug Brooks, President [email protected]
UltraCAD Design, Inc. http://www.ultracad.com

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