[SI-LIST] : Package analysis & design positions available @ Intel, Chandler, AZ

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From: Polka, Lesley A ([email protected])
Date: Fri Aug 18 2000 - 13:19:15 PDT

There are several positions open in our group at Intel, Corp.,
in the areas of package design and technology development for
packaging for Intel products. These positions are for the
Chandler, AZ, site. We are seeking candidates for both entry-level
and more senior positions.

Candidates must have a B.S. in Electrical Engineering. We are
also interested in candidates with M.S. and Ph.D.'s in Electrical
Engineering. Both experienced candidates and recent graduates will
be considered.

Some of the basic qualifications include: solid background in
electronics, electromagnetics, and circuit theory fundamentals.
Familiarity with and interest in electronic packaging,
characterization techniques, and signal integrity are also desired.

For more details or to submit a resume, please contact:

Lesley Polka: [email protected]


Chee-Yee Chung: [email protected]

                                          --- Lesley Polka

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