RE: [SI-LIST] : wire bond vs flip chip?

From: Toby Bauter ([email protected])
Date: Wed Jun 14 2000 - 11:01:07 PDT

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>From a cost stand point, how much per I/O is it to wire bond a die?

Regards,
Toby

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• Next message: Daniel, Erik S.: "RE: [SI-LIST] : Upper limit of interplane capacitance"
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• Maybe in reply to: Weber Chuang: "[SI-LIST] : wire bond vs flip chip?"

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