CALL FOR PARTICIPATION
3rd IEEE WORKSHOP ON
SIGNAL PROPAGATION ON INTERCONNECTS
Sponsored by the IEEE Computer Society
May 19-21, 1999
MARITIM-TitiseeHotel, Titisee-Neustadt, Germany
http://www.tet.uni-hannover.de/SPI
During the last two years the IEEE Workshop on Signal Propagation on
Interconnects has developed into a forum of exchange on the latest
research results in this area. The aim of this ensuing workshop is to
report on the most recent developments in the field of interconnect
modelling,
simulation and measurement on chips, boards and packages. The event is also
meant to bring together developers and researchers from industry and
academia
in order to encourage cooperation. In view of the last years' success the
committee is looking forward to the 3rd IEEE Workshop on Signal Propagation
on Interconnects where world class developers and researchers will share and
discuss leading edge results in Titisee-Neustadt, Black Forest, Germany.
The workshop will be held in English.
Main topics of the workshop will include, but are not limited to:
- dI-Noise
- Broadband Measurement Techniques and Theory
- Coupling Effects on Interconnects
- Determination of Characteristic Parameters
- Field Theory
- Ground Bounce
- Guided Waves on Interconnects
- Measurement, Modeling, and Simulation of
Interconnects inside of Packages
- Non-Linear Modeling and Analysis
- Propagation Characteristics on Signal and Ground
Lines
- Radiation and Interference
- Simulation Techniques for 2- and 3-dimensional
Interconnect Structures
- Substrate Influence on Signal Propagation
- Interconnects and Testing
- Optical Interconnects
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