We do not have a general agreement within the design community on the use
of this technique, so I just wanted to bounce it off of this reflector.
Multi-layer PCB's have power and ground planes as a norm. This technique
stacks some of these planes very close together (2 mil thin dielectrics)
to act as a giant capacitor.
The design uses thru-hole vias only.
Are we:
1) reducing noise
2) using this as an alternative to filter-caps
3) using this in conjunction with filter-caps.
4) At what frequencies is this practice appropriate.
5) anything else you can add.
Thanks
Bob Harrison
TRW