Can anyone point me to information about BGA packages? I am interested
in the following information:
- manufacturing issues - what problems can arise. What advantages are
there?
- signal integrity issues - advantages / disadvantages. Best decoupling
capacitor placements. Best via placements etc ...
- anything else I should know about?
Thanks in advance for any help ..
Andrew Phillips
Design Engineer
Cooperative Research Centre for Broadband Telecommunications &
Networking
Perth, Western Australia
[email protected]
http://www.atri.curtin.edu.au/~andrew