So then, is there no one here who advocates running traces from IC
power/ground pins first to a bypass capacitor, and then on to the
power/ground planes?
I thought my question might have touched off some argument, or at
least someone saying that it works in some cases. (Such as the
person who last week told me to do this for mixed-signal devices
that don't specifically need filtered power.)
One reply mentioned removing the thermal reliefs from the vias.
Is this a common practice? Does it really make a difference?
Regards,
Andy Ingraham