-Ray
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>From [email protected] Wed Sep 4 14:24:18 1996
Date: Wed, 04 Sep 96 14:15:00 PDT
From: Tomm V Aldridge <[email protected]>
To: Raymond.Anderson@Eng
Subject: Re: Modeling - Fast Tr
Content-Length: 1861
Text item:
IF this is your number one problem then I suggest option 4 with Maxwell
spicelink or an equivalent. If it is lower on the priority list then I
would use option 2.
Tomm
______________________________ Reply Separator _________________________________
Subject: Modeling - Fast Tr
Author: [email protected] at SMTPGATE
Date: 9/4/96 12:37 PM
I am forwarding this message from Fabrizio Zanella at Teradyne
([email protected]). The mail forwarding system choked but I think
I have it fixed now.
Ray Anderson
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REGARDING Modeling - Fast Tr
Hope everyone has had a good summer.
I have a generic question regarding creating interconnect models for
simulation at extremely fast rise times. The scenario is this: signals with
150ps rise time are being transmitted through an interconnect, like a right
angle connector, which is 200ps long. Since the connector is electrically
long, what is the best alternative for creating an electromagnetic model that
will yield accurate results at 150ps edge rates? My options are, using BEM or
FEM analysis:
1) Break connector into seven to ten 2D slices, and create lumped element
model subcircuits
2) Break connector into seven to ten 2D slices, and create distributed model
subcircuits
3) Draw a one section 3D model of the connector, and create a lumped element
subcircuit.
4) Draw a one section 3D model of the connector, and create a distributed
model subcircuit.
Any feedback or past experiences or mention of other methods would be greatly
appreciated.
Thanks and regards,
Fabrizio Zanella
Signal Integrity Engineer
Teradyne
44 Simon Street
Nashua NH 03060
603-791-3542
FAX 603-791-3046
[email protected]
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