I have had a discussion with a colleague from SNI about the location of the
ground connection of shield layers in multiple PCB (computer-)systems.
The ideal shield-layer is a currentless plane on the component sides of
a multi layer PCB.
Till today we connect the shield layers of the PCBs only to the
shield layer of the backplane which is connected itself at one single point
with system ground.
With respect to the aim of better decoupling between different PCBs we believe
that it might be better to connect the shield layer of each PCB at the board
connector with some groundpins and the shield of the backplane.
Are there any experience or comments to one ore both of this shield
techniques?
A happy new year to everybody!
Regards,
Joachim Mueller
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