... Rich Mellitz
Intel
-----Original Message-----
From: Greim, Michael [mailto:[email protected]]
Sent: Thursday, September 16, 1999 8:50 AM
To: '[email protected], "Volk, Andrew M"';
'[email protected]'
Subject: [SI-LIST] : RE: Another decoupling question
I can appreciate the value of that, however, I would think
that
most manufacturing folks would run kicking and screaming
from a multi-stage assembly approach. What happens when
the caps fail as a short. You end up having to pull
up/reball
and perhaps scrap a potentially expensive BGA to save the
.01 cent capacitor.
From a manufacturability perspective, I would advocate
getting
as close as possible to the outer edge of the chip and
decoupling
on the opposite side of the board. Chips on top of chips is
a
bad idea. IMHO.
Michael C. Greim
Consulting Engineer
Mercury Computer Systems, Inc email: [email protected]
199 Riverneck Road V:
978-256-0052/x1607
Chelmsford, MA 01824-2820 F:
978-256-4778
> -----Original Message-----
> From: Volk, Andrew M [SMTP:[email protected]]
> Sent: Wednesday, September 15, 1999 5:04 PM
> To: '[email protected]'
> Subject: RE: Another decoupling question
>
> SI Listeners -
>
> Another question on decoupling. I have recently heard
about capacitors
> that are supposedly thin enough to fit under a standard
MBGA package
> (Novacap for one). This would give excellent decoupling
as it is close to
> the package power balls, but still mounts on the top of
the board avoiding
> backside components.
>
> Has anyone had any experience with this type of device and
this kind of
> manufacturing step (cap under BGA package)?
>
> Andrew Volk
> Intel Corp.
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