Can anyone comment on the necessity of metallizing the backside of the die
if we want to ground the backside? In other words, if we want to have an
electrical connection between the package substrate and the backside of the
die, is backside metallization required or is the presence of electrically
conductive adhesive sufficient (assuming the die sits on a grounded die
pad)?
Thanks,
Matt
Matt Kaufmann
Senior Packaging Engineer
Silicon Spice Inc.
[email protected]
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