RE: [SI-LIST] : Stackup Extraction

Michael C. Greim ([email protected])
Thu, 19 Aug 1999 09:40:02 -0500

Here's something that you might not have considered. Other than
edge connector boards where you are tied to a specific card thickness
most other systems are specified in terms of card guide thickness.
By performing milling on the top and bottom sides of card in the
guide area allows the designer the flexibility to use substrate
thicknesses and copper weights that he needs while meeting the
requirements of the system. This is easily the most cost effective
way to get there from here compared with esoteric materials or
low yield thicknesses of material or traces. This has worked
very well for us in the past.

Best Regards,

Michael

At 08:37 AM 8/19/99 -0500, Mike Mayer wrote:
>An issue that comes up on some of our boards is that the overall board
>thickness is spec'ed as .062". On some of our boards the finished
>layup gets compressed to .062". If you depend on the data in the PCB
>tool it has to take that into account and not just use the "raw",
>pre-compression dielectric thicknesses.
>
>--
>=============================================================================
>Mike Mayer Artesyn Communication Products, Inc
> Madison, WI
> http://www.artesyn.com/cp
>=============================================================================
>
>
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The bounds of time, space or mechanics should never
stand in the way of a perfectly good idea.

The time is gone, the email's over, thought I'd
something more to say....

Michael C.Greim DNA Enterprises, Inc
Technology Director 269 West Renner Parkway
email: [email protected] Richardson, TX 75080
Phone: (972) 644-3301 Fax: (972) 644-6338

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