AW: [SI-LIST] : Proposal: Rs correlation/collaboration for W-Elem

John, Hans-Joerg ([email protected])
Wed, 4 Aug 1999 09:20:39 +0200

Hello Vadim,

in ANSI/IPC-MF-150F (Metal Foil for Printed Wiring Applications) you =
information regarding the foil profile. There are three types: =
Standard, Low
Profile and Very Low Profile. In paragraph 3.4.5 of this standard =
are given for the different types:

Low Profile: < 10.2 micron
Very Low Profile: < 5.1 micron

For the Standard type no values are specified!

Additional you can find the resistivity of the copper foil as a =
function of
the thickness!! This results from the different influence of the =
profile for
my opinion.

Best regards


Dr.-Ing. Hans-Joerg John phone: +49 5251 820 347=09
Siemens AG fax: +49 5251 820 349=09
EMC and Signal Integrity Design Support
mailto:[email protected]

Heinz-Nixdorf-Ring 1 =09
D-33106 Paderborn

> -----Urspr=FCngliche Nachricht-----
> Von: Heyfitch, Vadim [SMTP:[email protected]]
> Gesendet am: Mittwoch, 4. August 1999 03:58
> An: '[email protected]'
> Betreff: RE: [SI-LIST] : Proposal: Rs correlation/collaboration for
> W-Elem ents
> Such measurements should allow us to nail down the surface roughness
> parameter that is required by field solvers. Rs is rather sensitive =
> this
> parameter making it into a good fudge factor. (At 1GHz, skin depth is
> about
> 2 micron. Does anyone know how this compares to typical Cu etch
> roughness?)
> Vadim

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