[SI-LIST] : Call for presentations, 3-D packaging advanced technology worksho

Lyke James Civ AFRL/VSSE ([email protected])
Tue, 20 Jul 1999 15:32:32 -0600

Is anyone out there interested in giving a talk to the 3-D packaging
community on the signal integrity implications of 3-D packaging, or future
trends in signal integrity that could impact 3-D packaging? The workshop
is in Chicago, Monday 25 October. I have conducted an Advanced Technology
Workshop for the International Microelectronics and Packaging Society
(IMAPS) for the last four years on 3-D, and I never have really got a good
discussion on this topic.

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